The 15thChina Semiconductor Packaging Test Technology & Marketing Annual Conference Successfully Wrapped Up

2017-09-15

The 15^thChina Semiconductor Packaging Test Technology & Marketing Annual Conference was grandly held in Jiangyin City on June 22, 2017, at which over 1,000 industry delegates at home and abroad attended. The conference was organizedby China Semiconductor Industry Association, and presented by China Semiconductor Industry Association Packaging Branch, Jiangyin National Hi-tech Industrial Development Zone and Jiangsu Changjiang Electronics Technology Co., Ltd. (hereinafter referred to as JCET).

Guests present at the conference included: Zhou Zixue, President of China Semiconductor Industry Association, CaiYeming, Mayor of Jiangyin Municipal People’s Government, Chen Xinghua, a member of the Standing Committee of CPC Jiangyin Municipal Committee, Deputy Secretary of the Party Working Committee of Jiangyin National Hi-tech Industrial Development Zone and Deputy Director of Jiangyin National Hi-tech Industrial Development Zone Management Committee, Zhao Qiang, Deputy Mayor of Jiangyin Municipal People’s Government, Ding Wenwu, CEO of China Integrated Circuit Industry Investment Fund Co., Ltd., Wang Xi, Vice Chairman of China Association for Science and Technology, academician of Chinese Academy of Sciences (CAS) and Director of CAS Shanghai Institute of Microsystem and Information Technology, Lu Jun, CEO of Sino IC Capital Investment Management Co., Ltd., Zhao Haijun, CEO of Semiconductor Manufacturing International Corporation, XuXiaotian, Executive Deputy Director and Secretary-General of China Semiconductor Industry Association, Bi Keyun, Vice President of China Semiconductor Industry Association and Honorary President of China Semiconductor Industry Association Packaging Branch, Wang Xinchao, Rotating President of China Semiconductor Industry Association Packaging Branch and Chairman of JCET, Shi Mingda, Rotating President of China Semiconductor Industry Association Packaging Branch and Chairman of Tongfu Microelectronics Co., Ltd., Xiao Shengli, Chairman of TianshuiHuatian Technology Co., Ltd., Liu Dai, Rotating President of China Semiconductor Industry Association Packaging Branch and Chairman of China Key System & Integrated Circuit Co., Ltd., as well as leaders of semiconductor industry associations in other regions.

With the theme “integration innovation, intelligent manufacturing, integration and sharing”, this conference focused on advanced packaging, system in package, packaging materials and processes, packaging manufacturing technology and equipment and other hot issues in the industry. At the occasion, government leaderships, entrepreneurs and well-known industry experts and scholars present jointly discussed the policies and development orientation of China’s semiconductor industry. Meanwhile, the annual China Semiconductor Industry Research Report was also released at the conference.

Wonderful Moments

I. Summit Forum - Leaders’ Speeches (June 22)

Chairman Wang, as the Rotating President of China Semiconductor Industry Association Packaging Branch,deliveres the welcome speech.

Zhou Zixue, President of China Semiconductor Industry Association and Chairman of Semiconductor Manufacturing International Corporation, delivers a speech themed by the development task and orientation and international environment of China’s semiconductor industry.

On behalf of Director DiaoShijing, Long Hanbing, Deputy Director of Electronic Information Division of the Ministry of Industry and Information Technology delivers a speech.

Wang Xi, Vice Chairman of China Association for Science and Technology, academician of Chinese Academy of Sciences (CAS) and Director of CAS Shanghai Institute of Microsystem and Information Technology, delivers a speech at the Opening Ceremony.

Lu Jun, CEO of Sino IC Capital Investment Management Co., Ltd., delivers a speech at the Opening Ceremony.

Mayor CaiYemingdelivers a speech at the Opening Ceremony.

On behalf of the CPC Jiangyin Municipal Committee and Municipal Government, Mayor Cai extended his congratulations to the conference held in Jiangyin for the first time. After introducing the basic information of Jiangyin City, he indicated that the governments at all levels and related departments of Jiangyin would provide full supports and all-round services for the transformation and upgrading of enterprises, and hoped that Jiangyin’ s IC enterprises like Semiconductor Manufacturing International Corporation and JCET could make greater contribution to the achievement of new Jiangyin with “strong economy, rich citizens, beautiful environment and high social civilization”.

II. Summit Forum - Theme Report (on the morning of June 22)

Wang Xinchao: Status Quo and Prospect of China’s Semiconductor Packaging Industry

Chairman Wang firstly affirmed the achievements of semiconductor packaging and testing industry in China and greatly improved competitiveness of the industry. Meanwhile, he indicated the development trend of major advanced packaging technologies in his report, including system in package (SiP), fan-out wafer-level packaging (FO-WLP) and panel-level packaging. In addition, he also expressed that China’s semiconductor packaging and testing industry was facing many favorable opportunities together with great challenges.

Ding Wenwu: Transformation and Opportunities of IC Industry and Big Fund Investment Strategy

CEO Ding delivered his theme report in three aspects, namely, the new changes in the development of global IC industry and new situations of China’s IC industry development, and investment strategy for the Big Fund. He emphasized that, with the Moor’s Lawreaching its limits and the rising of emerging application fields, the competitive pattern of segmented fields accelerated to take shape, and global IC industry had stepped into the key transformation and reform period.

Zhao Haijun: Focusing on the IC Large-scale Production Technology

It was the first time for Dr. Zhao to deliver a speech since he took office in Semiconductor Manufacturing International Corporation. Dr. Zhao expressed that as the Moor’s Law would continue, the success of IC industry should be embodied in the aspect of large-scale production, and excellent large-scale production should be reflected in all aspects.

Chen Xinghua: Introduction to Jiangyin National Hi-tech Industrial Development Zone

Chen Xinghua, a member of the Standing Committee of CPC Jiangyin Municipal Committee, Deputy Secretary of the Party Working Committee of Jiangyin National Hi-tech Industrial Development Zone and Deputy Director of Jiangyin National Hi-tech Industrial Development Zone Management Committee introduces the Jiangyin National Hi-tech Industrial Development Zone.

Liu Ming: IC Packaging Technologies and Trends of the Market

Liu Ming, Senior Vice President of JCET, gives the speech.

III. Thematic Meetings (June 23)

Three thematic meetings held on June 23 witnessed full attendance.