IMAPS DPC
Mar 7-10, 2022
Arizona, United States

2022-02-11

      The 18th Annual Device Packaging Conference(DPC 2022) was held at the WeKoPa Resort and Conference Center, from March 7-10,It is an international event organized by the international Microelectronics Assembly and Packaging Society(IMAPS)
      Our overseas team hosted many visitors that came from several continets and contries. The JCET team was pleasantly surprised with the number of attendees given the recently relaxed Covid-19 protocols.Our exhibit booth saw good traffic as contacts from many of the top semiconductor companies stoped by to talk about our latest market-leading packaging technologies.