턴키 서비스
JCET delivers world-class services to its customers. The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider–from IC design through test program development, wafer bump, wafer probe, multi-die stacked assembly, final test, packaging, and shipment to end customers.
JCET offers the broadest portfolios of comprehensive packaging and test services in the semiconductor industry and can leverage its strong packaging and test capabilities to provide a full turnkey solution of integrated packaging, testing, and direct shipment to end customers.