한국어
The China’s IC Packaging & Testing Industry Chain Technical Innovation Alliance was established in Beijing
2010-01-05
The first industrial technical innovation alliance among the Key Special National Science & Technology Projects _ the China’s IC Packaging & Testing Industry Chain Technical Innovation Alliance was established in Beijing on December 30, 2009. Around the key special project of “very large-scale integrated circuit manufacturing equipment and complete set of processes”, the Alliance will strive to make a breakthrough in the key IC packaging and testing industry chain technology. Chairman Wang of CET was elected Chairman of the Alliance.
Alliance Chairman Wang Xinchao expressed in his speech that the Alliance is to immediately carry out three tasks. First, an analysis of the international packaging technology roadmap should be made to find a breakthrough from those packaging forms, in which not only the independent intellectual property rights are necessary, but also catching up with the international standards in a short time; second, from the perspective of future industrialized development of the IC packaging and testing enterprises, the demand for IC packaging & testing equipment and materials can drive these industries to develop satisfying and marketable products; and third, with the rapid development of IC packaging and testing industry, the management bottleneck has become more obvious, therefore, it is necessary to find the gap with the international advanced enterprises and add investment to the corporate management.
Alliance Chairman Wang Xinchao expressed in his speech that the Alliance is to immediately carry out three tasks. First, an analysis of the international packaging technology roadmap should be made to find a breakthrough from those packaging forms, in which not only the independent intellectual property rights are necessary, but also catching up with the international standards in a short time; second, from the perspective of future industrialized development of the IC packaging and testing enterprises, the demand for IC packaging & testing equipment and materials can drive these industries to develop satisfying and marketable products; and third, with the rapid development of IC packaging and testing industry, the management bottleneck has become more obvious, therefore, it is necessary to find the gap with the international advanced enterprises and add investment to the corporate management.
