Dr. Dongkai Shangguan et al came to Jiangyin Changdian Advanced Packaging Co., Ltd. for an exchange visit

Dr. Dongkai Shangguan, CEO of Advanced Semiconductor Packaging Technology Research & Development Center (ASPTC) and his attendants visited Jiangyin Changdian Advanced Packaging Co., Ltd. on September 12, 2012 for doing survey and research, with the company of President Wang Xinchao. After he listened to the introduction of JCAP about their Wafer bumping, WLCSP, FCOL, TSVCIS and some other ongoing projects, he expressed his appreciation of JCAP’s achievements in terms of technologies and intellectual properties, and decided to view JCAP as one of the key partners with his own company. A preliminary discussion was conducted mutually as to their subsequent cooperation in the area of advanced packaging technology.