JCAP + JSCC join efforts to build mass production platform of advanced 14nm wafer process-based packaging

JCAP + JSCC join efforts to build mass production platform of advanced 14nm wafer process-based packaging

Posted on November 17, 2016

Recently,good news kept coming out from JCAP and JSCC. The 14nm wafer process-based SiP has successfully passed the electrical performance and reliability verification of customers, and the mass production officially kicked off. The first batch of 12"wafer mass production has been shipped from JCAP and JSCC since October, and the mass production keeps going on. The success greatly encourages the production and engineering teams of both JCAP and JSCC. In addition, the success shows the industry that JCAP and JSCC became the first two manufacturers to produce 14nm process bumping and FCBGA in a large scale, and they have reached the highest level of high-end packaging at home.